发明名称 METHOD AND DEVICE FOR MOUNTING ELECTRONIC COMPONENT
摘要 <P>PROBLEM TO BE SOLVED: To provide a method and device for mounting electronic components capable of easily specifying a measurement position according to the deflection state of a printed board. <P>SOLUTION: A printed board P for measurement sample is positioned by a positioning part, and then a backup base is raised so that a backup pin abuts with the rear surface of the board P, for horizontal supporting. Based on the measurement result of a level detecting device for deflecting state of the board P, a CPU performs 3D display or contour line display on a monitor. When an operator specifies a measurement position on a screen, the CPU transforms the specified positions into coordinates on the board P, and adds the specified coordinates to the top of mounting data, which is stored in a RAM. At production operation for the board P, the level detecting device measures the level of a specified measurement position according to the mounting data where the specified coordinates have been added, and stores the result in the RAM. The measurement values are used when mounting electronic components. <P>COPYRIGHT: (C)2009,JPO&INPIT
申请公布号 JP2008277451(A) 申请公布日期 2008.11.13
申请号 JP20070117762 申请日期 2007.04.26
申请人 HITACHI HIGH-TECH INSTRUMENTS CO LTD 发明人 ONISHI SEIJI
分类号 H05K13/04;G06T1/00 主分类号 H05K13/04
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