| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a heat dissipation board which can achieve an excellent heat dissipation performance. <P>SOLUTION: The heat dissipation board 10 includes a circuit board 11 which is such that a metal circuit 15 is bonded on one surface 14a of a ceramic substrate 14 and a metal plate 16 is bonded on the other surface 14b. A semiconductor element 12 is bonded to the metal circuit 15 of the circuit board 11. On the circumferential surfaces 14c and 15a of the ceramic substrate 14 and the metal circuit 15 which constitute the surface of the circuit board 11, concavo-convex portions 141 and 151 for heat dissipation are formed. <P>COPYRIGHT: (C)2009,JPO&INPIT</p> |
