| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To obtain high heat radiation effect while maintaining insulation by filling a heat transfer resin at a predetermined thinness between a heat generating component and a case doubling as a heat sink in a configuration for radiating heat from the heat-generating electronic component surface-mounted on a substrate to the case via the heat transfer resin. <P>SOLUTION: The heat radiation device is provided with a substrate on which a heat-generating electronic component is surface-mounted, the case doubling as the heat sink for housing and holding the substrate, a spacer provided so as to form a predetermined gap between the substrate and the case opposing each other, and an insulating heat transfer resin filled in the gap. <P>COPYRIGHT: (C)2009,JPO&INPIT</p> |
