发明名称 METHOD FOR MANUFACTURING ELECTRONIC COMPONENT
摘要 PROBLEM TO BE SOLVED: To provide a method for manufacturing an electronic component, which can efficiently manufacture an electronic device, such as very small coil in which conductor wirings are hardly short-circuited each other, without entailing a large amount of time and work. SOLUTION: The method includes the steps of winding or laminating a multilayer film 4 comprising a conductor wiring 2 and an insulating layer 3 so as to form a wound body 5 as a laminate; bonding the layers of the wound body 5; cutting the wound body 5 to be a predetermined thickness; etching a cutting surface of the wound body 5; after etching process, melting the insulating layer 3 which remains on the edge of the cutting surface, and covering the edge of the cutting surface of the electronic component with the insulating layer 3. COPYRIGHT: (C)2009,JPO&INPIT
申请公布号 JP2008277864(A) 申请公布日期 2008.11.13
申请号 JP20080200972 申请日期 2008.08.04
申请人 PANASONIC CORP 发明人 YAMAMOTO MASAHIRO;HAYATA HIROSHI
分类号 H01F41/04;H02K3/26;H02K15/04 主分类号 H01F41/04
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