Method of Manufacturing a Package Carrier For Enclosing at Least One Microelectronic Element and Method and Method of Manufacturing a Diagnostic Device

摘要

A package enclosing at least one microelectronic element ( 60 ) such as a sensor die and having electrically conductive connection pads ( 31 ) for electric connection of the package to another device is manufactured by providing a sacrificial carrier; applying an electrically conductive pattern ( 30 ) to one side of the carrier; bending the carrier in order to create a shape of the carrier in which the carrier has an elevated portion and recessed portions; forming a body member ( 45 ) on the carrier at the side where the electrically conductive pattern ( 30 ) is present; removing the sacrificial carrier; and placing a microelectronic element ( 60 ) in a recess ( 47 ) which has been created in the body member ( 45 ) at the position where the elevated portion of the carrier has been, and connecting the microelectronic element ( 60 ) to the electrically conductive pattern ( 30 ). Furthermore, a hole ( 41 ) is arranged in the package for providing access to a sensitive surface of the microelectronic element ( 60 ).