| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a transfer apparatus and a transfer method which are suitable for carrying out a transfer by avoiding damages cause of tabular members, even if tabular members, such as, a semiconductor wafer where enlargement and thinning are carried out are considered as objects of transfer. <P>SOLUTION: The present invention relates to a transfer apparatus 10 for transferring the tabular members, such as a semiconductor wafer W, between a first table T1, a second table T2, or a third table T3, including a support means 11 equipped with a support face for the semiconductor wafer W, and an articulated robot 12 moving the support means 11. The support face is constituted by a laminate of an adhesive sheet S, formed by laminating an adhesive layer A on a sheet base material SB and can be transferred between the tables T1 to T3, by bonding the adhesive sheet S of an outermost layer with the semiconductor wafer W, and by peeling off the adhesive sheet S of the outer-most layer from the semiconductor wafer W. <P>COPYRIGHT: (C)2009,JPO&INPIT</p> |
