| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor device which can be miniaturized without increasing the area of the contact surface between an electrode terminal and an external conductor, and to provide a cooling method for the semiconductor device. SOLUTION: The semiconductor device 600 of this invention has a power module 616 comprising a semiconductor chip 601, a chip mounting metal electrode 603 on which the semiconductor chip 601 is mounted, and the electrode terminal 607 connected with an external bus bar 617, a heat sink 605 for cooling the semiconductor chip 601, and an insulating sheet 604 for insulating the power module 616 from the heat sink 605. The electrode terminal 607 comprises a terminal connection portion 613 connected with the external bus bar 617 on the side face of the power module 616, a current-carrying electrode portion 609 connected with the semiconductor chip 601 or the chip mounting metal electrode 603, and an electrode terminal cooling portion 608 in contact with the insulating sheet 604. COPYRIGHT: (C)2009,JPO&INPIT |
