| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor device which can shorten a manufacturing time, prevent nozzle clogging upon formation of a coat member, improve the contactness of the coat member, and prevent outside leakage of the coat member. SOLUTION: Sealing resin members 1, 2 have a notch 1a therein obtained by cutting their angular parts, in which one end of a dummy part 3a of a lead 3 and semiconductor elements 5a, 5b are sealed. The other end of the dummy part 3a is exposed. A coat member 4 covers the dummy part 3a exposed from the sealing members 1, 2. The sealing members 1, 2 has a projection 1b which is located within the notch 1a and is positioned between the coat member 4 and a side surface 12a (or 12b, 12c). COPYRIGHT: (C)2009,JPO&INPIT |
