| 摘要 |
PROBLEM TO BE SOLVED: To provide a resin paste for die bonding which can be easily supplied/applied by a printing method to a substrate to which a semiconductor chip needs to be pasted at a comparatively low temperature, enables following processes even when time is shortened and working temperature is lowered in transition to a B stage, and causes less volatile matter content in the transition to the B stage. SOLUTION: The resin paste for die bonding contains (A) ethylenic unsaturated compound having a blocked isocyanate group, (B) butadiene polymer, (C) thermosetting resin and (D) filler, wherein concentration of nonvolatile matter is 90% by weight. COPYRIGHT: (C)2009,JPO&INPIT
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