发明名称 PLATING TOOL FOR ELECTRONIC COMPONENT
摘要 PROBLEM TO BE SOLVED: To provide a plating tool with which time and labor for treatments after plating can be reduced and an electronic component can be prevented from being damaged or deformed during plating. SOLUTION: The plating tool is equipped with a negative electrode 12 provided to a negative electrode plate 11, a cushion material 13 interposed between the negative electrode plate 11 and the negative electrode 12, and a plurality of magnets 21 for attracting/holding electronic components 1 to the negative electrode side 12. The negative electrode 12 has a three-layer structure comprising a urethane film, a silver paste layer and an adhesive layer. The cushion material 13 has flexibility and is attached to the adhesive layer of the negative electrode 12 and held by the negative electrode plate 11. The magnets 21 are buried in the negative electrode plate 11. COPYRIGHT: (C)2009,JPO&INPIT
申请公布号 JP2008274320(A) 申请公布日期 2008.11.13
申请号 JP20070116277 申请日期 2007.04.26
申请人 MATSUSHITA ELECTRIC IND CO LTD 发明人 OBATA NAOHIKO
分类号 C25D17/16;C25D17/08;C25D17/10;C25D17/12 主分类号 C25D17/16
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