| 摘要 |
PROBLEM TO BE SOLVED: To remove the dust in a treatment section, miniaturize the apparatus, improve the throughput of the treatment and improve the yield thereof. SOLUTION: In substrate transfer treatment wherein a wafer is transferred into the treatment section by a transferring means and is subjected to the treatment, a collecting plate PL in the state capable of collecting dust and transferred by a main arm A2 as a transferring means is carried into an application treatment unit 32 before the treatment of the wafer W, and the dust occurring in the application treatment unit adheres to and is collected by the collecting plate. The collecting plate which has collected the dust is carried into a cleaning unit 80, the collected dust is removed in this cleaning unit by cleaning, and the collecting plate from which the dust being removed is reconditioned into the state capable of collecting the dust through charging by e.g. an ionizer 200. The collecting plate reconditioned into the state capable of collecting the dust is carried into the treatment section before the treatment by the main arm, and the dust occurring in the treatment section adheres to and is collected by the collecting plate. COPYRIGHT: (C)2009,JPO&INPIT
|
