发明名称 METHOD FOR CONTACTING ELECTRICAL COMPONENTS
摘要 The invention relates to a method for electrically contacting electrical components (122) on a carrier (110), said method comprising the following steps: (a) at least one dispersion (116) comprising electroconductive particles is applied in at least one region of the carrier (110); (b) at least one electrical component (122) is applied to the dispersion (116), and (c) the dispersion (116) is fully or partially metallised in a currentless and/or galvanised manner. The invention also relates to an electrical module (134) comprising at least one carrier (110) and at least one electrical component (122). The electrical component (122) is contacted on the carrier (110) using an inventive method. The invention further relates to a device for carrying out the inventive method, to a dispersion (116) for using in the inventive method, and to a use of said dispersion (116).
申请公布号 WO2008101884(A3) 申请公布日期 2008.11.13
申请号 WO2008EP51909 申请日期 2008.02.18
申请人 BASF SE;LOCHTMAN, RENE;WAGNER, NORBERT;KACZUN, JUERGEN;PFISTER, JUERGEN;ADDAMO RAFFAELE, ANTONINO;NOERENBERG, RALF 发明人 LOCHTMAN, RENE;WAGNER, NORBERT;KACZUN, JUERGEN;PFISTER, JUERGEN;ADDAMO RAFFAELE, ANTONINO;NOERENBERG, RALF
分类号 H05K3/32 主分类号 H05K3/32
代理机构 代理人
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