| 摘要 |
<p>A module (11) is provided. The module comprises: a substrate (1) and two pin structures (3). The pin structure comprises pins (4) and a pin carrier (0). Each of the pins is mounted on the pin carrier independently. The number of the pin structures is two or more. They are disposed on the two sides of the substrate respectively, and used to connect the substrate and the motherboard (12). At least two locating protrudings (6) are disposed on the pin carrier. The locating holes (7) on the substrate correspond to locating protrudings on the pin carrier, and they are located on the same straight line. The locating protrudings on the pin carrier are assembled with the substrate through the locating holes. An electric assembly is provided as well, the electric assembly comprises the module and the motherboard. The module and electric assembly can ensure the assembled pins and the motherboard coplanar.</p> |
