| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a multilayer board that has capabilities of forming a low-resistance embedding electrode without use of the etching process and bringing the low-resistance embedding electrode into contact with an ITO transparent electrode to reduce the wiring resistance of the ITO transparent electrode, while increasing the light passing through the multilayer board, and to provide a manufacturing method for such a multilayer board. <P>SOLUTION: The multilayer board having a first board, a second board, an embedding electrode and an ITO transparent electrode uses a conductive material for the embedding electrode material, wherein the second board is layered on the first board, and the embedding electrode is embedded into the second board with its top face exposed, while the ITO transparent electrode is layered on the second board into which the embedding electrode is embedded for electrical contact between the embedding electrode and the ITO transparent electrode. <P>COPYRIGHT: (C)2009,JPO&INPIT</p> |
