| 发明名称 |
HEAT DISSIPATION MODULE AND METHOD FOR FABRICATING THE SAME |
| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a heat dissipation module including a substrate, a PCB and at least one LED chip. <P>SOLUTION: A surface of the substrate 110 has at least one positioning portion 112 protruding upward. The PCB 120 has at least one positioning hole 122 corresponding to the positioning portion. The PCB is disposed on the surface of the substrate, such that the positioning portion is located in the positioning hole. The LED chip 130 is disposed on the positioning portion and electrically connected to the PCB. <P>COPYRIGHT: (C)2009,JPO&INPIT |
| 申请公布号 |
JP2008277817(A) |
申请公布日期 |
2008.11.13 |
| 申请号 |
JP20080112077 |
申请日期 |
2008.04.23 |
| 申请人 |
ADVANCE CONNECTEK INC;TYSUN INC |
发明人 |
LIN SHUN-TIAN;HUANG JYUN-WEI |
| 分类号 |
H01L23/36;H01L33/52;H01L33/62;H01L33/64 |
主分类号 |
H01L23/36 |
| 代理机构 |
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