METHOD FOR FORMING RESIST PATTERN, AND SEMICONDUCTOR DEVICE MANUFACTURED BY THE METHOD

摘要

PROBLEM TO BE SOLVED: To provide a method for forming a resist pattern having a sufficiently-high water-shedding property required in a liquid immesion exposure and a suppressive effect for an exfoliation of a film, and to provide a semiconductor device manufactured by the method.

SOLUTION: The embodiment of this invention comprises the steps of arranging an objective lens on a substrate of the semiconductor device with a film to be processed; and forming the resist pattern by the liquid immersion exposure for forming the liquid film between the objective lens and the substrate to exposure. The substrate processed by a water-shedding chemical comprising at least the water shedding agent and the solvent is exposed.

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