| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a chip light emitting diode capable of minimizing the thickness and the weight of an electric sign where the chip light emitting diodes are mounted, preventing shading a part of an irradiation plane of the chip light emitting diode caused by surface tension of applied silicone, and preventing impeding luminosity. <P>SOLUTION: A base mounted with chip light emitting diodes is adhered to and mounted on the front side of a printed circuit board. Simultaneously, transparent caps having respectively a cylindrical body and a half sphere tip is attached on the base to protect the internal chip light emitting diode. In addition, both lead wires of an outdoor light emitting diode installed on the base are formed so that they may be folded at the exterior of the base to be exposed, and a joint section formed at both ends of the exposed lead wires is directly adhered to and mounted on the front side of the printed circuit board. <P>COPYRIGHT: (C)2009,JPO&INPIT |
