| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor manufacturing device which reflects radiant heat toward the inside a furnace and prevents heat from escaping to the outside of a heater region. SOLUTION: A semiconductor heat treatment apparatus for executing an annealing process in a lateral furnace comprises: a reaction pipe 3 for which a gas injection port 5 is provided on one end and a sealing lid 7 using an O ring 6 is attached to the other end; a heater coil 8 wound around the heat treatment reaction portion of the reaction pipe 3; a gold pipe 4 which covers the reaction pipe 3 at the portion of a heater unit 9 around which the heater coil 8 is wound, and whose inside is coated with gold; and a gold coated buffer plate 12 whose surface is coated with the gold. The gold coated buffer plate 12 is disposed at one end of the portion of the heater unit 9 to prevent the leakage of the radiant heat inside the reaction pipe 3. COPYRIGHT: (C)2009,JPO&INPIT
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