| 摘要 |
PROBLEM TO BE SOLVED: To provide a heat dissipation structure which helps to design an electronic apparatus easily and allows easy installation and prevents over-transmission of heat from a heating element to the outside. SOLUTION: The heat dissipation structure comprises the heating element 11 having an output of 2 W or below, a substrate 12 to fix the heating element 11 to, a heat diffusion film 13, and a supporting body 14 for supporting the heat diffusion film 13 in such a state that the heat diffusion film 13 may face the heating element 11. The heat diffusion film 13 includes a graphite film 15 having a thermal conductivity of 500 W m<SP>-1</SP>K<SP>-1</SP>or above in the lateral direction, a heat conductivity of 30 W m<SP>-1</SP>K<SP>-1</SP>or below in the thickness direction, and a thickness of 100μm or below. The heating element 11 and the heat diffusion film 13 are not in contact and the distance between the two is 0.3 mm or below. COPYRIGHT: (C)2009,JPO&INPIT
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