| 摘要 |
The object is to provide copper foil of high adhesion even when the roughness R<SUB>z </SUB>of a nodular surface of the copper foil is low, and a method of manufacturing the copper foil. To achieve this object, there is adopted a copper foil which is characterized in that an area coefficient C(S), which is defined by A(S)/B(S) from a three-dimensional surface area A(S), which is obtained by performing three-dimensional measurement of a surface area of a nodular surface of a copper foil sample S under a laser microscope, and from a measuring region area B(S), which is an area of a measuring region of the three-dimensional surface area A(S), and a roughness R<SUB>z</SUB>(S) of a nodular surface of the copper foil sample S, which is measured by a stylus-type roughness meter, have a relationship of equation (1) below, and in that the roughness R<SUB>z</SUB>(S) is 1.0 mum to 3.0 mum, <?in-line-formulae description="In-line Formulae" end="lead"?>0.5xR<SUB>z</SUB>(S)+0.5<=C(S) (1)<?in-line-formulae description="In-line Formulae" end="tail"?> where R<SUB>z</SUB>(S) is a numerical value represented by mum.
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