| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor device of high reliability which reinforces protection of a Pb-free solder. SOLUTION: In a flip-flop type semiconductor device having bumps connected with a Pb-free solder, an under fill formed under a semiconductor chip has an elastic modulus of 6 to 8 GPa at 25°C and a linear expansion coefficient of 35 ppm/K or less at a temperature not higher than a glass transition temperature, and an underfill formed at the outer periphery of the chip or at a corner thereof has an elastic modulus of 6 GPa or less at 25°C and a linear expansion coefficient of 50 ppm/K or less at a temperature not higher than the glass transition temperature. COPYRIGHT: (C)2009,JPO&INPIT
|
