发明名称 THERMOELECTRIC MODULE
摘要 PROBLEM TO BE SOLVED: To provide a thermoelectric module wherein the specified number of p-type thermoelectric elements and n-type thermoelectric elements are arranged in a plane shape, one set of thin-film substrates with an electrode provided respectively are fitted to both end faces of the p-type and n-type thermoelectric elements, and the p-type and n-type thermoelectric elements are connected in series and that can entirely equalize stress to be loaded during assembly of the thermoelectric module, to the water cooling plate of a heat exchanging unit and an opposite member to a heat exchanging plate or the like, uniformly and thoroughly bring the thermoelectric module to the opposite member, reduce contact thermal resistance between the thermoelectric module and the opposite member, and improve its performance and quality. SOLUTION: A fitting hole penetrates the central portion of one-side thin-film substrate and another-side thin-film substrate in the thermoelectric module, and such the fitting hole also penetrates the vicinity thereof. COPYRIGHT: (C)2009,JPO&INPIT
申请公布号 JP2008277404(A) 申请公布日期 2008.11.13
申请号 JP20070116881 申请日期 2007.04.26
申请人 KOMATSU ELECTRONICS INC 发明人 KIYOZAWA KO
分类号 H01L35/30;H02N11/00 主分类号 H01L35/30
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