发明名称 HEAT RADIATION SHEET
摘要 PROBLEM TO BE SOLVED: To provide a heat radiation sheet ensuring a high cooling effect for heat generated from an electronic component and a circuit board or the like with electronic components by only directly attaching the sheet on the component or the circuit board. SOLUTION: A heat generating member can be cooled effectively by constituting the heat radiation sheet by providing a radiating layer formed of a heat radiating material to one surface of a flexible substrate and a bonding layer formed of an adhesive material to the other surface and also providing a coupled heat conductive part for connecting the front surface of the bonding layer and the flexible substrate. COPYRIGHT: (C)2009,JPO&INPIT
申请公布号 JP2008277408(A) 申请公布日期 2008.11.13
申请号 JP20070116938 申请日期 2007.04.26
申请人 MATSUSHITA ELECTRIC IND CO LTD 发明人 KONO TAKUMI;MIZOO YOSHIAKI;YAMANISHI TOSHIHIRO;SAKAI MICHIE;KUMEGAWA KAZUAKI
分类号 H01L23/36;B32B7/02;B32B7/14 主分类号 H01L23/36
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