发明名称 |
HEAT RADIATION SHEET |
摘要 |
PROBLEM TO BE SOLVED: To provide a heat radiation sheet ensuring a high cooling effect for heat generated from an electronic component and a circuit board or the like with electronic components by only directly attaching the sheet on the component or the circuit board. SOLUTION: A heat generating member can be cooled effectively by constituting the heat radiation sheet by providing a radiating layer formed of a heat radiating material to one surface of a flexible substrate and a bonding layer formed of an adhesive material to the other surface and also providing a coupled heat conductive part for connecting the front surface of the bonding layer and the flexible substrate. COPYRIGHT: (C)2009,JPO&INPIT
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申请公布号 |
JP2008277408(A) |
申请公布日期 |
2008.11.13 |
申请号 |
JP20070116938 |
申请日期 |
2007.04.26 |
申请人 |
MATSUSHITA ELECTRIC IND CO LTD |
发明人 |
KONO TAKUMI;MIZOO YOSHIAKI;YAMANISHI TOSHIHIRO;SAKAI MICHIE;KUMEGAWA KAZUAKI |
分类号 |
H01L23/36;B32B7/02;B32B7/14 |
主分类号 |
H01L23/36 |
代理机构 |
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