发明名称 COMPOUND SEMICONDUCTOR MANUFACTURING EQUIPMENT
摘要 PROBLEM TO BE SOLVED: To provide compound semiconductor manufacturing equipment which can reduce a cost by improving the use efficiency of materials and improving productivity by shortening a growth time, in the manufacturing of an epitaxial wafer by metal organic chemical vapor deposition. SOLUTION: The compound semiconductor manufacturing equipment is metal organic chemical vapor deposition equipment for growing a compound semiconductor epitaxial layer on a substrate, and has a disc-like susceptor as part of an upper wall for forming a growth gas channel and also has a facing plate which faces the susceptor and constitutes the lower wall of the growth gas channel. A plurality of substrates are concentrically disposed in the susceptor with growth planes of the substrates faced toward the growth gas channel. A growth gas is introduced from a portion of the facing plate facing the center of the susceptor, and exhausted toward the outside of the susceptor. A flow rate of the growth gas is set to 15-80 NL/min and the height of the growth gas channel is controlled to 1-30 mm. COPYRIGHT: (C)2009,JPO&INPIT
申请公布号 JP2008277435(A) 申请公布日期 2008.11.13
申请号 JP20070117273 申请日期 2007.04.26
申请人 HITACHI CABLE LTD 发明人 ISONO RYOTA;FUJIKAWA KAZUNARI
分类号 H01L21/205;C23C16/455;H01L21/331;H01L21/338;H01L29/737;H01L29/778;H01L29/812 主分类号 H01L21/205
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