发明名称 COOLING STRUCTURE OF ELECTRIC CIRCUIT DEVICE
摘要 PROBLEM TO BE SOLVED: To provide a cooling structure of an electric circuit device capable of effectively cooling a heat generating part even in an uneven temperature in a case. SOLUTION: In the cooling structure of the electric circuit device, water channels for cooling water are formed to the bottom of the case housing the heat generating part to cool the heat generating part in an electric circuit. In the cooling structure of the electric circuit device, a plurality of vertically separated water channels are formed in the cross section of the case placing the heat generating part, and the water channels are arranged so as to be crossed on a plane. COPYRIGHT: (C)2009,JPO&INPIT
申请公布号 JP2008277364(A) 申请公布日期 2008.11.13
申请号 JP20070116336 申请日期 2007.04.26
申请人 SHINDENGEN ELECTRIC MFG CO LTD 发明人 MARSUDI BUDI UTOMO
分类号 H05K7/20;H01L23/473 主分类号 H05K7/20
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