发明名称 |
PROCESS FOR MAKING STUBLESS PRINTED CIRCUIT BOARDS |
摘要 |
A process of copper plating a through-hole in a printed circuit board, and the printed circuit board made from such process. The process comprises: providing a printed circuit board with at least two copper interconnect lines separated by an insulator in the vertical direction; providing a through-hole in the printed circuit board in the vertical direction such that the interconnect lines provide a copper land in the through-hole; applying a seed layer to an interior surface of the through-hole; removing an outermost portion of the seed layer from the interior surface of the through-hole with a laser; applying copper on the seed layer.
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申请公布号 |
US2008277154(A1) |
申请公布日期 |
2008.11.13 |
申请号 |
US20080176615 |
申请日期 |
2008.07.21 |
申请人 |
BUCHWALTER STEPHEN L;BUDD RUSSELL A |
发明人 |
BUCHWALTER STEPHEN L.;BUDD RUSSELL A. |
分类号 |
H01R12/04;H05K3/30 |
主分类号 |
H01R12/04 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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