| 摘要 |
The invention provides a printed circuit board capable of mounting BGA or other IC package of narrow terminal interval by using through-holes of conventional size. On one principal surface of printed circuit board ( 1 ), soldering lands ( 2 a), ( 2 b), ( 2 c), and ( 2 d) for connecting solder balls are disposed in lattice. Central point (B) of through-hole ( 3 ) is set eccentric to the side of soldering land ( 2 a) at the same potential as through-hole ( 3 ), remote from intersection (A) formed by diagonal line ( 200 ab) linking soldering lands ( 2 a) and ( 2 b) and diagonal line ( 200 cd) linking soldering lands ( 2 c) and ( 2 d).
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