SEMICONDUCTOR DEVICE, ELECTRONIC EQUIPMENT, AND MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE

摘要

PROBLEM TO BE SOLVED: To provide a semiconductor device and electronic equipment having improved yields by equipping a conductive pattern formed appropriately without any step caused disconnection from the upper portion to the lower portion in a high stepped part, and to provide a manufacturing method of the semiconductor device. SOLUTION: The semiconductor device has: a first insulation film 11 that has a first opening 11a reaching a substrate 10 and is formed on the substrate 10; a second insulation film 13 that has a second opening 13a reaching the substrate 10 in a first opening 11a and covers the first insulation film 11; and a conductive pattern 15 provided on the second insulation film 13 while being in contact with the substrate 10 via the second opening 13a. The second insulation film 13 covers the upper shoulder section of the first opening 11a in a round shape. COPYRIGHT: (C)2009,JPO&INPIT