| 摘要 |
PROBLEM TO BE SOLVED: To thin and simply manufacture a double-sided electrode package facilitating connection with a package to be laminated on the upper side. SOLUTION: A package substrate 12 has wiring 20 for electrically connecting a semiconductor chip 44 and a columnar surface-side terminal 36 of which one end is connected to the wiring 20 electrically. The semiconductor chip 44 is sealed with a sealing resin 50. The surface of the sealing resin 50 is allowed to be flush with (the same surface) the end face of the other end of the surface-side terminal 36 by grinding, from the surface, a resin layer molded, while covering the semiconductor chip 44. The surface of the sealing resin 50 is a ground surface 50G formed by grinding. An end face 36A of the surface-side terminal 36 is exposed to the ground surface 50G of the sealing resin 50. COPYRIGHT: (C)2009,JPO&INPIT
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