| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide an inexpensive and reliable cooling device of a power semiconductor element which keeps the temperature of the power semiconductor element low, and reduces a volume of an air-cooling heat sink. <P>SOLUTION: The cooling device of the power semiconductor element 2 radiates heat generated at a power semiconductor module 1 by the air-cooling heat sink 8. This device is formed by stacking a plurality of power semiconductor modules 1 and a plurality of air-cooling heat sinks 8, and is comprised of a fan 9 which blows cooling winds to the air-cooling heat sinks 8. Heat radiation fins 7 of the air-cooling heat sinks 8 are reduced in thickness, with narrow pitches. <P>COPYRIGHT: (C)2009,JPO&INPIT |
