| 摘要 |
PROBLEM TO BE SOLVED: To provide a copper alloy thin film for forming an interconnection and an electrode for flat panel display, using a thin film transistor (TFT) that is superior in adhesiveness, and to provide a sputtering target for forming the copper alloy thin film. SOLUTION: The interconnection and an electrode for flat panel display using a thin-film transistor having superior adhesiveness, formed by a copper alloy thin film having a composition containing oxygen by 0.4 to 6 atomic%, one or more of Ni, Co and Zn by 0.001 to 3 atomic% in total, and the rest consisting of Cu and unavoidable impurities, and is also relates to a sputtering target for forming interconnections and the electrode. COPYRIGHT: (C)2009,JPO&INPIT
|
