THERMAL DECOMPOSITION DEVICE FOR LIQUID PHASE PCB

摘要

PROBLEM TO BE SOLVED: To inexpensively thermally decompose a liquid phase PCB in safety without using fossil fuel. SOLUTION: A thermal decomposing process of the liquid phase PCB is divided into a gasifying process by a gasification furnace 20 and a combustion process by an optical combustion furnace unit 40, and necessary treatment temperatures are achieved in each of the treatment processes. As it is unnecessary to increase a temperature of the whole incinerator, a cost for maintaining the temperature can be reduced. Electric heat is utilized as a heat source of the gasification furnace 20, and heat-ray light of a discharge lamp 4E is utilized as a heat source of the optical combustion furnace unit 40. The heat-ray light of the discharge lamp 4E can increase its heat-ray concentration by a convergence method by a collector 4T as it is light, ultrahigh temperature necessary for thermally decomposing dioxin can be achieved with a simple device constitution. COPYRIGHT: (C)2009,JPO&INPIT