发明名称 |
NON-VOLATILE MEMORY DEVICE, METHOD OF FABRICATING THE SAME, AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME |
摘要 |
A non-volatile memory device which can be highly-integrated without a decrease in reliability, and a method of fabricating the same, are provided. In the non-volatile memory device, a first doped layer of a first conductivity type is disposed on a substrate. A semiconductor pillar of a second conductivity type opposite to the first conductivity type extends upward from the first doped layer. A first control gate electrode substantially surrounds a first sidewall of the semiconductor pillar. A second control gate electrode substantially surrounds a second sidewall of the semiconductor pillar and is separated from the first control gate electrode. A second doped layer of the first conductivity type is disposed on the semiconductor pillar.
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申请公布号 |
US2008277720(A1) |
申请公布日期 |
2008.11.13 |
申请号 |
US20080112965 |
申请日期 |
2008.04.30 |
申请人 |
SAMSUNG ELECTRONICS CO., LTD. |
发明人 |
YOUN SUN-PIL;KIM HYEONG-JUN;KANG JIN-TAE;JOO YOUNG-JAE |
分类号 |
H01L29/72 |
主分类号 |
H01L29/72 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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