发明名称 NON-VOLATILE MEMORY DEVICE, METHOD OF FABRICATING THE SAME, AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME
摘要 A non-volatile memory device which can be highly-integrated without a decrease in reliability, and a method of fabricating the same, are provided. In the non-volatile memory device, a first doped layer of a first conductivity type is disposed on a substrate. A semiconductor pillar of a second conductivity type opposite to the first conductivity type extends upward from the first doped layer. A first control gate electrode substantially surrounds a first sidewall of the semiconductor pillar. A second control gate electrode substantially surrounds a second sidewall of the semiconductor pillar and is separated from the first control gate electrode. A second doped layer of the first conductivity type is disposed on the semiconductor pillar.
申请公布号 US2008277720(A1) 申请公布日期 2008.11.13
申请号 US20080112965 申请日期 2008.04.30
申请人 SAMSUNG ELECTRONICS CO., LTD. 发明人 YOUN SUN-PIL;KIM HYEONG-JUN;KANG JIN-TAE;JOO YOUNG-JAE
分类号 H01L29/72 主分类号 H01L29/72
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