AGITATION OF ELECTROLYTIC SOLUTION IN ELECTRODEPOSITION
摘要
In a reverse pulse plating of a substrate (110), the electrolytic solution is agitated with a greater power on forward pulses (210) than on reverse pulses (220). An ultrasound agitation source (170) can be positioned at the bottom of the substrate (110) if the anode (134) is at the top. The ultrasound source may contact the substrate's bottom. Other features are also provided.
申请公布号
WO2008137459(A2)
申请公布日期
2008.11.13
申请号
WO2008US62027
申请日期
2008.04.30
申请人
TRU-SI TECHNOLOGIES, INC.;SAVASTIOUK, SERGEY;KOSENKO, VALENTIN;BERGER, ALEXANDER J.
发明人
SAVASTIOUK, SERGEY;KOSENKO, VALENTIN;BERGER, ALEXANDER J.