发明名称 |
METHOD FOR MANUFACTURING METAL NITRIDE LAYER, GROUP III NITRIDE SEMICONDUCTOR, METHOD OF MANUFACTURING THE SAME, AND SUBSTRATE FOR MANUFACTURING GROUP III NITRIDE SEMICONDUCTOR |
摘要 |
<P>PROBLEM TO BE SOLVED: To provide a method for manufacturing a group III nitride semiconductor such as a GaN semiconductor having a low dislocation density and excellent light emitting properties by utilizing a metal nitride layer formed on an SiC substrate. <P>SOLUTION: A metal layer is provided on the (0001)Si-surface of a¥the SiC substrate, then a metal nitride layer is formed by nitriding the metal layer, and the group III nitride semiconductor is formed on the metal nitride layer. Thereafter, the metal layer is dissolved by a chemical treatment or the like. Thereby, various semiconductor structures separated from the SiC substrate are obtained. As the metal layer, a Cr layer is used. <P>COPYRIGHT: (C)2009,JPO&INPIT |
申请公布号 |
JP2008273792(A) |
申请公布日期 |
2008.11.13 |
申请号 |
JP20070120138 |
申请日期 |
2007.04.27 |
申请人 |
TOHOKU TECHNO ARCH CO LTD;DOWA ELECTRONICS MATERIALS CO LTD |
发明人 |
YAO TAKAFUMI;CHIYO MEIKAN |
分类号 |
C30B29/38;C30B25/18;H01L21/205;H01L33/12;H01L33/32 |
主分类号 |
C30B29/38 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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