| 摘要 |
PROBLEM TO BE SOLVED: To manage hazardous elements through the use of a measuring method having only few errors in a method for managing hazardous elements in semiconductor sealing resins by a fluorescent X-ray analysis apparatus. SOLUTION: The method for managing hazardous elements in semiconductor sealing resins includes: the process of performing qualitatively the analysis by the fluorescent X-ray analysis apparatus to determine content; the sample preparation process of matching the upper and lower surfaces of samples and arranging the samples in overall X-ray irradiation surfaces; the process for performing quantitative analysis by measuring one surfaces of the samples and their opposite surfaces by the fluorescent X-ray analysis apparatus; and the process of performing determination based on threshold values through the use of determination results having fewer effects of coexistent elements among two items of data acquired in the quantitative analysis process. It is possible to accurately measure and manage hazardous elements in semiconductor sealing resins of semiconductor products by this method. COPYRIGHT: (C)2009,JPO&INPIT
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