| 摘要 |
PROBLEM TO BE SOLVED: To provide a curable resin composition which is excellent in mechanical strength, heat resistance, moisture resistance, flexibility, temperature cycle resistance, solder reflow resistance and dimensional stability after curing and exhibits high adhesion reliability and high conduction reliability. SOLUTION: The curable resin composition comprises an epoxy resin, a solid polymer having a functional group reactive with an epoxy group, and an epoxy resin curing agent. When a cured product of this curable resin composition is dyed with a heavy metal and observed with a transmission electron microscope, no phase separation structure is observed in the matrix resin composed of the resin, and the polymer having an epoxy group has an epoxy equivalent weight of 200-1,000. COPYRIGHT: (C)2009,JPO&INPIT
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