| 发明名称 |
SYSTEM AND A METHOD FOR CONTROLLING FLOW OF SOLDER |
| 摘要 |
An assembly including a solder wettable surface is provided. The assembly also includes a metal mask configured to restrict solder from flowing outside the solder wettable surface.
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| 申请公布号 |
US2008277456(A1) |
申请公布日期 |
2008.11.13 |
| 申请号 |
US20070746260 |
申请日期 |
2007.05.09 |
| 申请人 |
GENERAL ELECTRIC COMPANY |
发明人 |
GOWDA ARUN VIRUPAKSHA;DUROCHER KEVIN MATTHEW;ROSE JAMES WILSON;GILLESPIE PAUL JEFFREY;BEAUPRE RICHARD ALFRED;ESLER DAVID RICHARD |
| 分类号 |
B23K31/02;B23K35/14 |
主分类号 |
B23K31/02 |
| 代理机构 |
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代理人 |
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| 主权项 |
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| 地址 |
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