| 摘要 |
The light-emitting diode package is provided to improve the flexibility of installation and heat performance. The light-emitting diode package(40) comprises the first electrode(42) of the pillar shape for the heat dissipation and conduction. The first electrical insulator(43) is formed on the upper side of the first electrode The second electrode(47) surrounds the side of the first electrode, open the chip bonding region on the upper side of the first electrode and attaches the upper side of the first electrode, separated by the first electrical insulator. The second insulation material(48) insulates and fixes the first electrode and the second electrode, filled between the sides of the first electrode and the second electrode. |
