PCB AND MANUFACTURING METHOD THEREOF

摘要

A printed circuit board and the manufacturing method thereof is provided to secure enough thickness by forming a first circuit pattern with the ink jet method and forming the second circuit pattern on the first circuit pattern with plating. A printed circuit board(30) and manufacturing method thereof is comprised of steps: forming circuit patterns(32a, 32b) by spraying the conductive ink on the surface of the insulating layer(31); increasing the thickness of the circuit pattern by plating. In forming a circuit pattern, an one-layer circuit pattern is formed with one printing by using the ink jet method. A dam(33) is formed at the surface of the insulating layer, where the both border of the circuit pattern is contacted before increasing thickness.