发明名称 |
PROCESS FOR PRODUCING RESIN-COATED METAL POWDER, RESIN-COATED METAL POWDER AND CIRCUIT FORMING TONER |
摘要 |
<p>[Problem] With respect to powdery toner for forming a circuit described in Patent Document 1, it is complex to control a reaction system for coating a conductive material with a resin, and the condition of the resin coating significantly varies depending on the condition of the metal surface. With respect to metal toner for forming a conductive pattern described in Patent Document 2, a gaseous monomer is added while metal particles provided with a polymerization catalyst are dispersed in a gas phase to allow the polymerization to proceed on the surfaces of the particles. Therefore, large-scale facilities are required, and a reaction system is required to be highly controlled.
[Solving Means] A process for producing resin-coated metal particles, the process includes the steps of coating surfaces of copper particles with silica; allowing a polymerizable group to adsorb onto the surfaces of the silica-coated copper particles by the use of a silane coupling agent; and coating the surfaces of the silica-coated copper particles with a polymeric resin by mixing the copper particles to which the polymerizable groups adsorb, a polymerizable monomer, a polymerization initiator, and a dispersant to polymerize the polymerizable monomer and the polymerizable groups.</p> |
申请公布号 |
EP1674488(B1) |
申请公布日期 |
2008.11.12 |
申请号 |
EP20040773107 |
申请日期 |
2004.09.15 |
申请人 |
MURATA MANUFACTURING CO., LTD. |
发明人 |
UEDA, KIYOKO;NAKAMURA, ICHIRO;SAKURADA, KIYOYASU |
分类号 |
C08F292/00;H01B5/00;H01R11/00;H05K3/10;H05K3/12 |
主分类号 |
C08F292/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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