发明名称 PROCESS FOR PRODUCING RESIN-COATED METAL POWDER, RESIN-COATED METAL POWDER AND CIRCUIT FORMING TONER
摘要 <p>[Problem] With respect to powdery toner for forming a circuit described in Patent Document 1, it is complex to control a reaction system for coating a conductive material with a resin, and the condition of the resin coating significantly varies depending on the condition of the metal surface. With respect to metal toner for forming a conductive pattern described in Patent Document 2, a gaseous monomer is added while metal particles provided with a polymerization catalyst are dispersed in a gas phase to allow the polymerization to proceed on the surfaces of the particles. Therefore, large-scale facilities are required, and a reaction system is required to be highly controlled. [Solving Means] A process for producing resin-coated metal particles, the process includes the steps of coating surfaces of copper particles with silica; allowing a polymerizable group to adsorb onto the surfaces of the silica-coated copper particles by the use of a silane coupling agent; and coating the surfaces of the silica-coated copper particles with a polymeric resin by mixing the copper particles to which the polymerizable groups adsorb, a polymerizable monomer, a polymerization initiator, and a dispersant to polymerize the polymerizable monomer and the polymerizable groups.</p>
申请公布号 EP1674488(B1) 申请公布日期 2008.11.12
申请号 EP20040773107 申请日期 2004.09.15
申请人 MURATA MANUFACTURING CO., LTD. 发明人 UEDA, KIYOKO;NAKAMURA, ICHIRO;SAKURADA, KIYOYASU
分类号 C08F292/00;H01B5/00;H01R11/00;H05K3/10;H05K3/12 主分类号 C08F292/00
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