SEMICONDUCTOR PACKAGE AND METHOD OF FORMING THE SAME

摘要

It can be connected by an interposer even though the pad of memory device and the logic device or the bump's position is changed. The high speed operation can be implemented by the interposer even though the design change of the memory device and logic device. The semiconductor package comprises a printed circuit board(10); the first semiconductor chip(20) having on the printed circuit board; the chip package having on the first semiconductor chip; the chip package directly contacts with the first semiconductor chip; the second semiconductor chip on interposer. The interposer has the penetrating electrode(110). The first semiconductor chip comprises the first bump pad(24) arranged in the upper side. The first bump(105) contacts with the first bump pad. The printed circuit board comprises the solder ball arranged to the lower surface.