Optical communication device and optical communication device manufacturing method

摘要

The integrated circuit (IC) chip mounting substrate comprises a conductive circuit and inter-layer insulation layers at its both sides, and an outermost solder resist layer on which optical element is mounted. An optical signal transmission path is made to penetrate the substrate. Independent claims are also included for the following: (1) integrated circuit chip mounting substrate manufacturing method; (2) optical communication device; and (3) optical communication device manufacturing method.