| 摘要 |
A flexible PCB(Printed Circuit Board) is provided to emit the heat generated from LEDs to the outside by bonding a heat-radiation thin film to a base unit with a bonding sheet and coating heat-radiation coating material to a surface of the head conductive thin film. A first metallic layer is formed on both surface of polyimide film in a base unit(10), and a second metallic layer is formed on a portion of the surface of the base unit to mount an LEDs. On the rest portion except the portion of an upper coverlay unit(20), a polyimide layer(13) and a PSR(Photo Solder Resist)(14) are laminated in order. A heat radiation unit radiates the heat generated from the LEDs by being formed at a lower surface of the base unit. The heat radiation unit includes a heat-conductive bonding sheet(41), a heat-conductive thin film(42) and a heat-radiating coating material(43).
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