| 摘要 |
The warpage of the strip level substrate caused by carrier can be prevented by positioning the reject mark for monitoring existence and/or absence of fault of each unit substrate at the ball attaching surface of each unit substrate. The board for flip-chip package comprises the strip level(30) includes a plurality of unit substrates(32), the reject mark(34) for determining existence and/or non existence of fault of each unit substrate. The reject mark has the surface for adhering the solder ball in each unit substrate.
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