| 发明名称 |
Multiple leadframe laminated IC package |
| 摘要 |
A method of fabricating an integrated circuit package. The method includes providing a first leadframe and a second leadframe, laminating the second leadframe to a portion of the first leadframe in order to create a multi-layer laminated leadframe, and mounting a semiconductor die on another portion of the first leadframe.
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| 申请公布号 |
US7449771(B1) |
申请公布日期 |
2008.11.11 |
| 申请号 |
US20030681983 |
申请日期 |
2003.10.09 |
| 申请人 |
ASAT LTD. |
发明人 |
FAN CHUN HO;LIN TSUI YEE;KWAN KIN PUI;TSE SHUI MING;LAU WING HIM;WONG SHUK MAN |
| 分类号 |
H01L21/44;H01L23/492;H01L23/495 |
主分类号 |
H01L21/44 |
| 代理机构 |
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代理人 |
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| 主权项 |
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| 地址 |
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