发明名称 |
Driver chip and display apparatus including the same |
摘要 |
A driver chip includes a base body having a driver circuit formed therein. A plurality of conductive bumps is disposed over a top face of the base body, the plurality of conductive bumps being arranged in a plurality of rows along the longitudinal direction of the base body. A plurality of conductive wirings is formed over the top face of the base body that electrically connects the driver circuit to the plurality of conductive bumps. |
申请公布号 |
US7450393(B2) |
申请公布日期 |
2008.11.11 |
申请号 |
US20040881156 |
申请日期 |
2004.06.30 |
申请人 |
SAMSUNG ELECTRONICS CO., LTD. |
发明人 |
HWANG SEONG-YONG;OH WEON-SIK;CHOI SUNG-LAK;SONG CHUN-HO;YOON JU-YOUNG |
分类号 |
H01L21/60;H05K7/00;G02F1/13;G02F1/133;G02F1/1345;H01L23/48;H01L23/482 |
主分类号 |
H01L21/60 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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