发明名称 |
Dicing die-bonding film, method of fixing chipped work and semiconductor device |
摘要 |
The dicing die-bonding film of this invention comprises a pressure-sensitive adhesive layer on a supporting base material and a die-bonding adhesive layer on the pressure-sensitive adhesive layer, wherein a releasability in an interface between the pressure-sensitive adhesive layer and the die-bonding adhesive layer is different between an interface corresponding to a work-attaching region in the die-bonding adhesive layer and an interface corresponding to a part or the whole of the other region, and the releasability of the interface is higher than the releasability of the interface. According to this invention, there can be provided a dicing die-bonding film excellent in balance between retention in dicing a work and releasability in releasing its diced chipped work together with the die-bonding adhesive layer. |
申请公布号 |
US7449226(B2) |
申请公布日期 |
2008.11.11 |
申请号 |
US20040849414 |
申请日期 |
2004.05.19 |
申请人 |
NITTO DENKO CORPORATION |
发明人 |
MATSUMURA TAKESHI;MIZUTANI MASAKI;MISUMI SADAHITO |
分类号 |
B32B3/02;C09J7/02;C09J201/00;H01L21/301;H01L21/304;H01L21/44;H01L21/52;H01L21/58;H01L21/68;H01L21/78 |
主分类号 |
B32B3/02 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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