发明名称 MOUNTING METHOD
摘要 To provide a method for mounting electric parts on both surfaces of a substrate. The electric parts (32, 33) on the front and rear surfaces of the substrate (31) are simultaneously pressed by first and second pressing rubbers (15, 25). Therefore, the electric parts (32, 33) can be connected to the front and rear surfaces of the substrate (31) at a time. When the first and second pressing rubbers (15, 25) are deformed, the first and second rubbers (15, 25) are so interrupted by a dam member (16) as to be not expanded, since the peripheral areas of the pressing rubbers are surrounded by the dam member (16). Therefore, the electric parts (32, 33) are not displaced. Since the electric parts (32, 33) are connected to the substrate (31) at the same positions as in a temporary pressure bonding, an electric part (30a) with high connection reliability can be provided.
申请公布号 KR20080098617(A) 申请公布日期 2008.11.11
申请号 KR20087020517 申请日期 2007.02.13
申请人 SONY CHEMICAL & INFORMATION DEVICE CORPORATION 发明人 MATSUMURA TAKASHI
分类号 H05K3/30;H01L21/58;H05K1/18;H05K3/32 主分类号 H05K3/30
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