发明名称 |
Resin molded semiconductor device and mold |
摘要 |
To provide an excellent image by reducing buckling of a CCD device having one-dimensional CCD elements mounted thereon due to changes in temperature. Blackening treated iron or iron-based alloy is used as a material of a heat sink 11 having a one-dimensional CCD element 14 mounted thereon. The thermal coefficient of expansion of the heat sink 21 is matched with that of a hollow molded case 12 for integrally molding the heat sink 11 and a lead frame 20 . A plurality of projections 21 formed on the side of the hollow molded case 12 are disposed at a bonding interface between the glass cap 13 which closes an upper opening of the hollow molded case 12 and side walls of hollow molded case 12.
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申请公布号 |
US7448861(B2) |
申请公布日期 |
2008.11.11 |
申请号 |
US20050235182 |
申请日期 |
2005.09.27 |
申请人 |
NEC ELECTRONICS CORPORATION |
发明人 |
KOIKE MASAHIRO;NARITA HIROCHIKA |
分类号 |
B29C33/12;B29C45/14;B29C45/26;B29L31/34;H01L21/56;H01L23/047;H01L23/08;H01L23/10;H01L23/28;H01L27/148 |
主分类号 |
B29C33/12 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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